I have never really been satisfied with my first try at MB tray. Then I recently ran into this:
Sure I have known a lot about Zalman TNN-500, but this detail had escaped me: backside of the MB is thermally connected to the side of the case.
I began to think what should I change to have thermally conductive MB tray, and in the end I began to like the idea a lot more than the previous one. After all, no one sees the MB tray so it does not has to be transparent or fancy.
I further concluded that I might also get rid of some unnecessary resistance in my water loop if I could attach some of the less heating components to the MB tray plate and then watercool it.
This is pictured from the MB IO-panel side. My plan uses this aluminium profile meant for watercooling (click the flags in upper right corner to get some human-understandable language):
In the picture above is a design with three pieces of that liquid cooling element and then pieces of acrylic between them to act as rails. Each hole accepts G1/4″ fittings, but I might not want to connect all of them.
Since the regulators and DRAM modules do not need any extreme cooling, I plan to attach copper pieces to them from another end and to MB tray from the another. This means the heat has to travel some distance, but as said, they do not produce so much heat so if the MB tray is cooled below 20°C, there should be no problems for them to stay cool enough.
The advantage of this is that I can cool the regulators from both sides and I need less tight bends and fittings and thus can run with less unnecessary restrictions in the loop.
Maybe :-). It remains to be seen if my plan works.